Announcing a Special Issue of the
IEEE Transactions on Plasma Science on
Advances in Plasma Processing for Semiconductor Manufacturing
(Scheduled for August 2009)

Plasma science has played an integral role in semiconductor manufacturing for almost thirty years.  Plasma etching, plasma enhanced chemical vapor deposition, magnetron sputtering systems, plasma cleaning, plasma immersion implant, and plasma sources for beam line implant and light sources for lithography have all enabled the industry’s continued adherence to Moore’s Law that has defined the pace of integrated circuit technology development since 1965.

Significant advances in plasma assisted manufacturing of semiconductors have been made in recent years.  Theoretical, computational, and experimental work in this field has allowed for the necessary refinement in the control of electron heating, plasma chemistry, transport, and surface interactions to move semiconductor manufacturing into the nano-scale.

The intent of this Special Issue is to provide a forum and assemble papers addressing both the fundamental and applied aspects of plasma assisted materials processing in the semiconductor industry.  The plasmas of interest include, but are not restricted to:

Contributions will address aspects of radiographic systems including, but not limited to:

• Low temperature plasma processing: etch, CVD, and PVD processes including DC, RF-CCP, RF-ICP, ECR, helicon, microwave, hollow cathodes, etc.
• Plasma sources for processing: DUV and EUV light sources, plasma sources for beam line implantation, and novel source configurations for on-wafer processing.
• Atmospheric plasmas for semiconductor manufacturing.

Emphasis should be placed on theoretical, computational, and experimental studies that improve the understanding of mechanisms of importance for semiconductor device fabrication.  Contributions that compare plasma parameters to on-wafer process characteristics are highly encouraged.  Contributions that highlight plasma processing for advanced integrated circuit structures are also highly encouraged.  All contributions should be submitted electronically through the IEEE Manuscript Central web site at:
http://mc.manuscriptcentral.com/tps-ieee.

Submissions are Due 30 November 2008